JOURNAL ARTICLE

Micro-corrosion of Al-Cu bonding pads

Year: 1988 Journal:   Microelectronics Reliability Vol: 28 (5)Pages: 827-827   Publisher: Elsevier BV
Keywords:
Corrosion Metallurgy Materials science

Metrics

1
Cited By
0.00
FWCI (Field Weighted Citation Impact)
0
Refs
0.74
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Topics

Material Properties and Applications
Physical Sciences →  Materials Science →  General Materials Science
Corrosion Behavior and Inhibition
Physical Sciences →  Materials Science →  Materials Chemistry
Metal and Thin Film Mechanics
Physical Sciences →  Engineering →  Mechanics of Materials

Related Documents

JOURNAL ARTICLE

Micro-Corrosion of Al-Cu Bonding Pads

Simon ThomasH. Berg

Journal:   IEEE Transactions on Components Hybrids and Manufacturing Technology Year: 1987 Vol: 10 (2)Pages: 252-257
JOURNAL ARTICLE

Micro-Corrosion of Al-Cu Bonding Pads

Simon ThomasH. Berg

Journal:   Reliability physics Year: 1985 Pages: 153-158
JOURNAL ARTICLE

Micro-Structural Studies of Thermosonic Cu-Al Bonding Interface

T. Joseph Sahaya AnandChua Kok YauAzman Jalar

Journal:   Advanced materials research Year: 2014 Vol: 925 Pages: 154-158
© 2026 ScienceGate Book Chapters — All rights reserved.