Micro-Corrosion of Al-Cu Bonding Pads

Simon Thomas; H. Berg

doi:10.1109/irps.1985.362091

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JOURNAL ARTICLE

Micro-Corrosion of Al-Cu Bonding Pads

Simon Thomas H. Berg

Year: 1985 Journal: Reliability physics Pages: 153-158 Publisher: Institute of Electrical and Electronics Engineers

DOI: 10.1109/irps.1985.362091

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Abstract

Aluminum metallization films with copper additions are found to exhibit highly localized pitting in the presence of moisture. Galvanic action of aluminum surrounding Al2Cu theta phase particles causes localized aluminum corrosion. The thin layer of aluminum hydroxide corrosion product on the bonding pad creates an effective barrier to high quality wire bonding.

Keywords:

Materials science Aluminium Corrosion Galvanic corrosion Metallurgy Wire bonding Copper Hydroxide Layer (electronics) Galvanic cell Pitting corrosion Composite material Inorganic chemistry Chemistry

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Welding Techniques Analysis

Physical Sciences → Engineering → Mechanical Engineering

Metal Forming Simulation Techniques

Physical Sciences → Engineering → Mechanical Engineering

Micro-Corrosion of Al-Cu Bonding Pads

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