BOOK-CHAPTER
Micro Impact Testing of Lead Free Solder Joints
R. RajooE. H. KisiD.J. O'Connor
Year: 2008 Advanced materials research Pages: 99-102 Publisher: Trans Tech Publications
Keywords:
Lead (geology) Soldering Materials science Forensic engineering Metallurgy Engineering Geology
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Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Adhesion, Friction, and Surface Interactions
Physical Sciences → Engineering → Mechanics of Materials
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
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