BOOK-CHAPTER

Micro Impact Testing of Lead Free Solder Joints

R. RajooE. H. KisiD.J. O'Connor

Year: 2008 Advanced materials research Pages: 99-102   Publisher: Trans Tech Publications
Keywords:
Lead (geology) Soldering Materials science Forensic engineering Metallurgy Engineering Geology

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Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Adhesion, Friction, and Surface Interactions
Physical Sciences →  Engineering →  Mechanics of Materials
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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