Multicore solders introduces new lead-free no-clean solder paste for SMT assembly

JOURNAL ARTICLE

Year: 2000 Journal: Soldering and Surface Mount Technology Vol: 12 (3) Publisher: Emerald Publishing Limited

DOI: 10.1108/ssmt.2000.21912cad.024

Keywords:

Soldering Solder paste Lead (geology) Materials science Metallurgy

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering