Multicore solders introduces new lead-free no-clean solder cream for SMT assembly

JOURNAL ARTICLE

Year: 2002 Journal: Soldering and Surface Mount Technology Vol: 14 (1) Publisher: Emerald Publishing Limited

DOI: 10.1108/ssmt.2002.21914aad.013

Keywords:

Soldering Lead (geology) Solder paste Materials science Computer science Metallurgy Geology

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering