The inspection of solder joints on printed circuit boards by phase-shift holographic interferometry

Yulin Lu

doi:10.1016/0963-8695(90)90632-s

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The inspection of solder joints on printed circuit boards by phase-shift holographic interferometry

Yulin Lu

Year: 1990 Journal: NDT & E International Vol: 23 (3)Pages: 157-160 Publisher: Elsevier BV

DOI: 10.1016/0963-8695(90)90632-s

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Keywords:

Soldering Printed circuit board Holography Interferometry Materials science Holographic interferometry Phase (matter) Optics Composite material Engineering Electrical engineering Physics

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Integrated Circuits and Semiconductor Failure Analysis

Physical Sciences → Engineering → Electrical and Electronic Engineering

Surface Roughness and Optical Measurements

Physical Sciences → Engineering → Computational Mechanics

Optical measurement and interference techniques

Physical Sciences → Computer Science → Computer Vision and Pattern Recognition

The inspection of solder joints on printed circuit boards by phase-shift holographic interferometry

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