Laser Holographic Inspection Of Solder Joints On Printed Circuit Board (PCB)

Jing Hong; Geng Wanzhen; Lingzhen Jiang; Wei Xue; Jing Ma; Shi-jie Zhao; Jingfeng Yang

doi:10.1117/12.939057

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Laser Holographic Inspection Of Solder Joints On Printed Circuit Board (PCB)

Jing Hong Geng Wanzhen Lingzhen Jiang Wei Xue Jing Ma Shi-jie Zhao Jingfeng Yang

Year: 1988 Journal: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Vol: 0673 Pages: 176-176 Publisher: SPIE

DOI: 10.1117/12.939057

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Abstract

The principle of inspecting solder joints by holographic interferometric technique is introduced. The criterion of discriminating the flaws is suggested. The results are given and testified by metallographical sectioning.

Keywords:

Printed circuit board Soldering Holography Materials science Laser Interferometry Holographic interferometry Optics Composite material Engineering Electrical engineering Physics

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Surface Roughness and Optical Measurements

Physical Sciences → Engineering → Computational Mechanics

Integrated Circuits and Semiconductor Failure Analysis

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Surface Polishing Techniques

Physical Sciences → Engineering → Biomedical Engineering

Laser Holographic Inspection Of Solder Joints On Printed Circuit Board (PCB)

Abstract

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