Copper Interconnects Fabricated by Dry Etching Process

JOURNAL ARTICLE

Year: 1995

DOI: 10.7567/ssdm.1995.s-iv-9

Keywords:

Materials science Dry etching Etching (microfabrication) Copper Process (computing) Optoelectronics Composite material Metallurgy Computer science

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Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering