JOURNAL ARTICLE

Degradation Mechanism of Interfacial Adhesion between Screen-Printed Ag/Polyimide in Temperature/Humidity Environment

Byung-Hyun BaeHyeonchul LeeGahui KimKirak SonYoung-Bae Park

Year: 2021 Journal:   Electronic Materials Letters Vol: 17 (2)Pages: 157-163   Publisher: Springer Science+Business Media
Keywords:
Polyimide Materials science Humidity Penetration (warfare) Composite material Degradation (telecommunications) Relative humidity Pi Moisture Hydrolytic degradation Hydrolysis Layer (electronics) Adhesion Polymer Chemistry Organic chemistry Electrical engineering

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5
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0.37
FWCI (Field Weighted Citation Impact)
35
Refs
0.59
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Citation History

Topics

Nanomaterials and Printing Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Nanofabrication and Lithography Techniques
Physical Sciences →  Engineering →  Biomedical Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
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