JOURNAL ARTICLE
Degradation Mechanism of Interfacial Adhesion between Screen-Printed Ag/Polyimide in Temperature/Humidity Environment
Byung-Hyun BaeHyeonchul LeeGahui KimKirak SonYoung-Bae Park
Year: 2021 Journal: Electronic Materials Letters Vol: 17 (2)Pages: 157-163 Publisher: Springer Science+Business Media
Keywords:
Polyimide Materials science Humidity Penetration (warfare) Composite material Degradation (telecommunications) Relative humidity Pi Moisture Hydrolytic degradation Hydrolysis Layer (electronics) Adhesion Polymer Chemistry Organic chemistry Electrical engineering
Metrics
5
Cited By
0.37
FWCI (Field Weighted Citation Impact)
35
Refs
0.59
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Nanomaterials and Printing Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Nanofabrication and Lithography Techniques
Physical Sciences → Engineering → Biomedical Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
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