Effect of Temperature/Humidity Treatment on Interfacial Reliability on Screen-Printed Ag / Polyimide for Advanced Embedded Packaging Technologies

Abstract

Abstract The effect of temperature/humidity treatment conditions on the interfacial adhesion energy between a screen printed Ag film and a polyimide substrate was evaluated by using a 90° peel test. The measured peel strength values decrease from 254.7 N/m to 59.3 N/m after the temperature/humidity treatment at 85°CC/85% relative humidity for 500 h. X-ray photoelectron spectroscopy analysis of the peeled surfaces indicates that peeling occurs cohesively inside of the polyimide, which is closely related to both the decrease in the interfacial adhesion energy and the polyimide degradation due to weak boundary layer formation.