JOURNAL ARTICLE

Microstructure of plasma-deposited iron-nitride films

H. SiriwardaneC. PollyAlan SagoP. FraundorfO. A. PringleJoseph William NewkirkW. J. James

Year: 1995 Journal:   Proceedings annual meeting Electron Microscopy Society of America Vol: 53 Pages: 556-557   Publisher: Cambridge University Press

Abstract

Iron nitride films are potential candidates for information storage media. In order to use the films as a perpendicular magnetic recording media, it is necessary to know about the micro-, crystal, and magnetic structures, physical properties, and processing of these thin films. Here we describe the micro- structure of plasma-deposited iron nitride films. The microstructure of films deposited on glass and carbon support films on copper grids were investigated by X-ray diffraction (XRD), transmission electron microscopy (TEM), scanning electron microscopy (SEM), and Auger electron Spectroscopy (AES). According to XRD, single phase Fe 3 N was successfully produced on glass substrates at temperatures 200, 275, 400, & 500 °C, and flow ratios between 0.4 to 15.3 of Fe(CO) 5 , and NH 3 . Electron diffraction peak positions of films were compared with Fe 3 C, Fe 7 C 3 , Fe 2 N, Fe 3 N γ -Fe 4 N, Fe 5 N 2 and Fe 3 O 4 crystal structure d-spacings. The presence of a carbide satellite peak in AES data and by matching all d-spacings in the JCPDS Fe 3 C card file with every experimental diffraction pattem, enabled us to confirm the presence of Fe 3 C in these films at all deposition temperatures.

Keywords:
Microstructure Materials science Thin film Analytical Chemistry (journal) Auger electron spectroscopy Scanning electron microscope Transmission electron microscopy Nitride Electron diffraction Iron nitride Carbide Carbon nitride Crystallography Diffraction Metallurgy Layer (electronics) Nanotechnology Composite material Optics Chemistry

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Topics

Metal and Thin Film Mechanics
Physical Sciences →  Engineering →  Mechanics of Materials
Semiconductor materials and devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Copper Interconnects and Reliability
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials

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