Direct write fabrication of high-density parallel silver interconnects

Alan Shen; Dustin Caldwell; W. K. Anson; Sameh Dardona

doi:10.1016/j.addma.2018.05.010

ScienceGate Book Chapters

JOURNAL ARTICLE

Direct write fabrication of high-density parallel silver interconnects

Alan Shen Dustin Caldwell W. K. Anson Sameh Dardona

Year: 2018 Journal: Additive manufacturing Vol: 22 Pages: 343-350 Publisher: Elsevier BV

DOI: 10.1016/j.addma.2018.05.010

Get Full-Text PDF Get Analytical Report

Keywords:

Materials science Fabrication Substrate (aquarium) Electrical conductor Interconnection Inkwell Electrical resistivity and conductivity Volumetric flow rate Line (geometry) Optoelectronics Composite material Electrical engineering Computer science Mechanics

Metrics

Cited By

1.84

FWCI (Field Weighted Citation Impact)

Refs

0.87

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Citation History

Topics

Nanomaterials and Printing Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Sensor and Energy Harvesting Materials

Physical Sciences → Engineering → Biomedical Engineering

Nanofabrication and Lithography Techniques

Physical Sciences → Engineering → Biomedical Engineering

Direct write fabrication of high-density parallel silver interconnects

Metrics

Citation History

Topics

Related Documents

Fabrication of High Density Flex Cables Using Direct Write Laser Ablation

Laser direct-write process for fabrication of VLSI gate-array interconnects

Three‐Dimensional Printing of Interconnects by Laser Direct‐Write of Silver Nanopastes

Direct Write Fabrication of Waveguides and Interconnects for Optical Printed Wiring Boards

Density of parallel optical interconnects