Three‐Dimensional Printing of Interconnects by Laser Direct‐Write of Silver Nanopastes

Abstract

A novel non-contact 3-dimensional laser direct-write process is demonstrated. Freestanding silver interconnects with various widths (8–75 μm), loop heights (1–10 μm), and bond lengths (8–100 μm) are printed on various substrates. We demonstrate the capability of this technology for ultrafine (<1 μm) pitch bonding and for connecting LEDs embedded in flexible polyimide substrates Detailed facts of importance to specialist readers are published as "Supporting Information". Such documents are peer-reviewed, but not copy-edited or typeset. They are made available as submitted by the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.