JOURNAL ARTICLE

Investigation of free vibration analysis of functionally graded annular piezoelectric plate using COMSOL

Trivendra Kumar SharmaSandeep Kumar Parashar

Year: 2018 Journal:   AIP conference proceedings Vol: 1953 Pages: 140084-140084   Publisher: American Institute of Physics

Abstract

In the present age functionally graded piezoelectric materials (FGPM) are increasingly being used as actuators and sensors. In spite of the fact that the piezoelectric coupling coefficient for shear d15 has much higher value in comparison to d31 or d33, it is far less utilized for the applications due to complex nature of the shear induced vibrations. In this work three dimensional free vibration analysis of functionally graded piezoelectric material annular plates with free-free boundary conditions is presented. The annular FGPM plate is polarized along the radial direction while the electric field is applied along the thickness direction inducing flexural vibrations of the plate due to d15 effect of functionally graded piezoelectric materials. The material properties are assumed to have a power law variation along the thickness. COMSOL Multiphysics is used to obtain the natural frequencies and modeshapes. Detailed numerical study is performed to ascertain the effect of variation in power law index and various geometrical parameters. The results presented shall be helpful in optimizing the existing applications and developing the new ones utilizing the FGPM annular plates.

Keywords:
Multiphysics Materials science Piezoelectricity Vibration Boundary value problem Material properties Finite element method Acoustics Composite material Structural engineering Physics Mathematics Engineering Mathematical analysis

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Citation History

Topics

Composite Structure Analysis and Optimization
Physical Sciences →  Engineering →  Mechanics of Materials
Numerical methods in engineering
Physical Sciences →  Engineering →  Mechanics of Materials
Railway Engineering and Dynamics
Physical Sciences →  Engineering →  Mechanical Engineering

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