Enhanced diffusion of boron by oxygen precipitation in heavily boron-doped silicon

Abstract

The enhanced diffusion of boron has been investigated by analyzing out-diffusion profiles in the vicinity of the interface between a lightly boron-doped silicon epitaxial layer and a heavily boron-doped silicon substrate with a resistivity of 8.2 mΩ cm and an oxide precipitate (O.P.) density of 108–1010 cm−3. It is found that the boron diffusion during annealing at 850–1000 °C is enhanced with the increase of the oxide precipitate density. On the basis of a model for boron diffusion mediated by silicon self-interstitials, we reveal that the enhanced diffusion is attributed to self-interstitials supersaturated as a result of the emission from oxide precipitates and the absorption by punched-out dislocations. In addition, the temperature dependence of the fraction of the self-interstitial emission obtained analyzing the diffusion enhancement well explains the morphology changes of oxide precipitates reported in literature.