JOURNAL ARTICLE
Lead-Free Solders Property and Reliability of Electronics Packaging
Harumi YAGIOsamu HigashiMasayuki OchiaiYoshihisa KamiyaHitoshi HonmaMasayuki KitajimaTsuyoshi Yamamoto
Year: 2002 Journal: Proceedings of the 1992 Annual Meeting of JSME/MMD Vol: 2002 (0)Pages: 225-226 Publisher: Japan Society Mechanical Engineers
Abstract
This paper explains the joint reliability of the electronics packaging which uses lead-free solder. The basic physical properties of the lead-free solder materials as the Sn-Ag-Cu and the Sn-Zn are investigated and compared first. And, the joint reliability of the TSOP lead-type component was examined as one of electronic components with a short fatigue life.
Keywords:
Soldering Reliability (semiconductor) Electronic packaging Electronics Lead (geology) Joint (building) Materials science Physical property Electronic component Reliability engineering Component (thermodynamics) Mechanical engineering Metallurgy Composite material Engineering Electrical engineering Structural engineering
Metrics
1
Cited By
0.00
FWCI (Field Weighted Citation Impact)
0
Refs
0.37
Citation Normalized Percentile
Is in top 1%
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Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Material Properties and Processing
Physical Sciences → Engineering → Mechanics of Materials
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