JOURNAL ARTICLE
Lead (Pb)-free solders for electronic packaging
Year: 1994 Journal: Journal of Electronic Materials Vol: 23 (8)Pages: 701-707 Publisher: Springer Science+Business Media
Keywords:
Soldering Materials science Electronic packaging Eutectic system Creep Printed circuit board Electronic materials Lead (geology) Metallurgy Ultimate tensile strength Reliability (semiconductor) Composite material Computer science Microstructure Nanotechnology Geology
Metrics
331
Cited By
2.67
FWCI (Field Weighted Citation Impact)
33
Refs
0.91
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Aluminum Alloys Composites Properties
Physical Sciences → Engineering → Mechanical Engineering
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