JOURNAL ARTICLE
Composite lead-free electronic solders
Year: 2006 Journal: Journal of Materials Science Materials in Electronics Vol: 18 (1-3)Pages: 129-145 Publisher: Springer Science+Business Media
Keywords:
Soldering Composite number Lead (geology) Materials science Reinforcement Composite material
Metrics
115
Cited By
5.71
FWCI (Field Weighted Citation Impact)
54
Refs
0.96
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Metallurgical and Alloy Processes
Physical Sciences → Materials Science → General Materials Science
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