Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias

Fei He; Junjie Yu; Yuanxin Tan; Wei Chu; Changhe Zhou; Ya Cheng; Koji Sugioka

doi:10.1038/srep40785

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Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias

Fei He Junjie Yu Yuanxin Tan Wei Chu Changhe Zhou Ya Cheng Koji Sugioka

Year: 2017 Journal: Scientific Reports Vol: 7 (1)Pages: 40785-40785 Publisher: Nature Portfolio

DOI: 10.1038/srep40785

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Keywords:

Materials science Microelectronics Bessel function Fabrication Bessel beam Silicon Femtosecond Substrate (aquarium) Integrated circuit Footprint Optoelectronics Beam (structure) Optics Laser Physics

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Laser Material Processing Techniques

Physical Sciences → Engineering → Computational Mechanics

Advanced Surface Polishing Techniques

Physical Sciences → Engineering → Biomedical Engineering

Nanofabrication and Lithography Techniques

Physical Sciences → Engineering → Biomedical Engineering

Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias

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