Laser-Enhanced Palladium Electroless Plating

Abstract

SummaryLaser-enhanced palladium electroless plating was found to be possible in the presence of a small quantity of Tl+ or Pb2+. The thermal conductivity of the substrate is an important factor. In order to induce electroless plating, a localized increase in temperature at the metal-solution interface by laser irradiation is necessary. Although the laser-enhanced palladium plating did not occur on copper and brass, which are good heat-conductive materials, it became possible with 5 μm of poorly heat-conductive nickel plating on these metals. The effects of the velocity of flow of the plating solution and the laser power, on the shape of the palladium deposit were evaluated. Line drawing was attempted, and the best results were obtained at 7–7.5 μm/s of laser sweep rate, with which the line width was about 20 μm.