JOURNAL ARTICLE

Laser Enhanced Electroless Gold Plating.

Satoshi NAGAMINEKoichi KobayakawaYuichi Sato

Year: 1997 Journal:   The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits Vol: 12 (7)Pages: 497-502

Abstract

我々は, 毒性の高いシアン化物イオンを含まないノーシアン無電解金めっき液を使用して, 各種金属基板 (ニッケルめっき済みのNi-Fe合金, 黄銅, 銅基板) にレーザ照射無電解金めっきを行った。このめっき液は, シアン化物イオンに代わる金属源として塩化金酸, 還元剤に次亜リン酸ナトリウム, 錯形成剤にコハク酸イミド, チオシアン酸カリウムなどを用いる弱アルカリ性のめっき液である。レーザめっきにおいて被めっき物である基板の熱伝導率は重要であり, 同一レーザ出力, 照射時間で用いた基板のうち, 熱伝導率が最も小さいNi-Fe合金基板上で得られる金めっき物の高さが最大であった。これらめっき物の高さや直径は, レーザ出力や照射時間あるいはめっき液の循環速度によって制御できることがわかった。

Keywords:
Materials science Electroless plating Gold plating (software engineering) Plating (geology) Metallurgy Laser Gold alloys Nanotechnology Alloy Optics Computer science Electroplating Geology

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Topics

Electrodeposition and Electroless Coatings
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Metallurgical and Alloy Processes
Physical Sciences →  Materials Science →  General Materials Science

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