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JOURNAL ARTICLE

Direct wafer bonding technology of 300mm wafer

Sadato Hongo Kazumasa Tanida Nobuhisa Yamaguchi K. Takahashi

Year: 2011

DOI: 10.7567/ssdm.2011.p-2-1

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Keywords:

Materials science Wafer Wafer bonding Die preparation Nanotechnology Wafer-scale integration Wafer backgrinding Optoelectronics Wafer dicing

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Topics

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

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