Keywords:
Materials science Wafer Wafer bonding Die preparation Nanotechnology Wafer-scale integration Wafer backgrinding Optoelectronics Wafer dicing

Metrics

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FWCI (Field Weighted Citation Impact)
0
Refs
0.32
Citation Normalized Percentile
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Topics

3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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