Effects of Polyvinylpyrrolidone Molecular Weight on Adhesion Strength of Screen-Printed Cu Circuits to Polyimide Substrate

JOURNAL ARTICLE

Year: 2015 Journal: Nanoscience and Nanotechnology Letters Vol: 7 (12)Pages: 999-1003 Publisher: American Scientific Publishers

DOI: 10.1166/nnl.2015.2088

Keywords:

Polyvinylpyrrolidone Polyimide Materials science Substrate (aquarium) Adhesion Composite material Polymer chemistry Layer (electronics)

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Nanofabrication and Lithography Techniques

Physical Sciences → Engineering → Biomedical Engineering

Nanomaterials and Printing Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Sensor and Energy Harvesting Materials

Physical Sciences → Engineering → Biomedical Engineering