JOURNAL ARTICLE

Adhesion energy of Cu/polyimide interface in flexible printed circuits

Shoji KAMIYAHarunori FurutaMasaki Omiya

Year: 2007 Journal:   Surface and Coatings Technology Vol: 202 (4-7)Pages: 1084-1088   Publisher: Elsevier BV
Keywords:
Polyimide Materials science Adhesion Composite material Interface (matter) Surface energy Copper Deformation (meteorology) Layer (electronics) Metallurgy Contact angle

Metrics

46
Cited By
3.41
FWCI (Field Weighted Citation Impact)
9
Refs
0.93
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Synthesis and properties of polymers
Physical Sciences →  Materials Science →  Polymers and Plastics
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
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