Adhesion energy of Cu/polyimide interface in flexible printed circuits

Shoji KAMIYA; Harunori Furuta; Masaki Omiya

doi:10.1016/j.surfcoat.2007.07.061

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Adhesion energy of Cu/polyimide interface in flexible printed circuits

Shoji KAMIYA Harunori Furuta Masaki Omiya

Year: 2007 Journal: Surface and Coatings Technology Vol: 202 (4-7)Pages: 1084-1088 Publisher: Elsevier BV

DOI: 10.1016/j.surfcoat.2007.07.061

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Keywords:

Polyimide Materials science Adhesion Composite material Interface (matter) Surface energy Copper Deformation (meteorology) Layer (electronics) Metallurgy Contact angle

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Synthesis and properties of polymers

Physical Sciences → Materials Science → Polymers and Plastics

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Adhesion energy of Cu/polyimide interface in flexible printed circuits

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