Hysteresis behavior during facing target magnetron sputtering

Florian Cougnon; K. Strijckmans; R. Schelfhout; Diederik Depla

doi:10.1016/j.surfcoat.2016.03.096

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Hysteresis behavior during facing target magnetron sputtering

Florian Cougnon K. Strijckmans R. Schelfhout Diederik Depla

Year: 2016 Journal: Surface and Coatings Technology Vol: 294 Pages: 215-219 Publisher: Elsevier BV

DOI: 10.1016/j.surfcoat.2016.03.096

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Keywords:

Sputtering Hysteresis Materials science Critical point (mathematics) Sputter deposition High-power impulse magnetron sputtering Position (finance) Point (geometry) Deposition (geology) Chemical physics Nanotechnology Condensed matter physics Thin film Physics Geometry

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Metal and Thin Film Mechanics

Physical Sciences → Engineering → Mechanics of Materials

Ion-surface interactions and analysis

Physical Sciences → Engineering → Computational Mechanics

Semiconductor materials and devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

Hysteresis behavior during facing target magnetron sputtering

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