Abstract

Resistive switching memory (RRAM) is raising interest for future storage-class memory (SCM) and embedded applications due to high speed operation, low power and non-volatile behavior. While cycling endurance is currently well understood, the impact of cycling on switching and reliability is still a matter of concern. To that purpose we study the cycling-induced degradation of HfO x RRAM in this work. We show that the resistance of the low-resistance state (LRS), the set voltage V set and the reset voltage V reset decrease with cycling, which we attribute to defect generation causing enhanced ion mobility. The degradation kinetics is modelled by an Arrhenius-driven distributed-energy model. Our study allows to predict set/reset voltages after any arbitrary number of cycles and for any set/reset cycling condition.

Keywords:
Resistive random-access memory Reset (finance) Cycling Degradation (telecommunications) Temperature cycling Electrical engineering Computer science Reliability (semiconductor) Voltage Materials science Power (physics) Physics Engineering Thermodynamics

Metrics

13
Cited By
1.00
FWCI (Field Weighted Citation Impact)
5
Refs
0.83
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Advanced Memory and Neural Computing
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Ferroelectric and Negative Capacitance Devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Electronic and Structural Properties of Oxides
Physical Sciences →  Materials Science →  Materials Chemistry
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