JOURNAL ARTICLE
Development of a Dicing Blade Using Light-Hardening Resin
Wei PengWeijun HuangXue Feng Xu
Year: 2001 Journal: Key engineering materials Vol: 202-203 Pages: 99-102 Publisher: Trans Tech Publications
Keywords:
Wafer dicing Blade (archaeology) Materials science Hardening (computing) Composite material Structural engineering Engineering
Metrics
1
Cited By
0.49
FWCI (Field Weighted Citation Impact)
0
Refs
0.70
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Topics
Laser and Thermal Forming Techniques
Physical Sciences → Engineering → Computational Mechanics
Metal Alloys Wear and Properties
Physical Sciences → Materials Science → Materials Chemistry
Tribology and Lubrication Engineering
Physical Sciences → Engineering → Mechanical Engineering
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