Experimental study of stencil/substrate separation speed in on-contact solder paste printing for reflow soldering

JOURNAL ARTICLE

Year: 1993 Journal: Journal of Electronics Manufacturing Vol: 03 (01)Pages: 25-29 Publisher: Chapman and Hall London

DOI: 10.1142/s0960313193000048

Keywords:

Stencil Soldering Solder paste Substrate (aquarium) Materials science Mechanical engineering Composite material Engineering Computer science Geology

Metrics

Cited By

1.38

FWCI (Field Weighted Citation Impact)

Refs

0.83

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Recycling and Waste Management Techniques

Physical Sciences → Environmental Science → Industrial and Manufacturing Engineering

Metallurgical Processes and Thermodynamics

Physical Sciences → Engineering → Mechanical Engineering