JOURNAL ARTICLE

Throughput of multi-core processors under thermal constraints

Abstract

We analyze the effect of thermal constraints on the performance and power of multi-core processors. We propose system-level power and thermal models, and derive expressions for (a) the maximum number of cores that can be activated, with and without throttling, (b) the speedup (multi-core over single core), and the total power consumption, both as functions of the number of active cores. These expressions involve parameters like power per core, thermal resistance of hottest die block and package, and leakage dependence on temperature. We also computed the above metrics (a) and (b) numerically by solving the detailed Hotspot circuit of an multicore processor driven by a block-level exponential temperaturedependent leakage model. When compared to these numerical results, we found that the above expressions for (a) were at most 8% underpredicted, while those for (b) were accurately predicted. The proposed analytical approach is the first of its kind to relate metrics of interest in multi-core processors to high-level design parameters. Compared to numerical approaches, it provides much faster computation time, and valuable insight for processor designers.

Keywords:
Multi-core processor Speedup Computer science Computation Bandwidth throttling Parallel computing Power consumption Thermal Single-core Throughput Block (permutation group theory) Computational science Algorithm Electronic engineering Power (physics) Mathematics Engineering Physics Wireless Telecommunications

Metrics

43
Cited By
5.32
FWCI (Field Weighted Citation Impact)
15
Refs
0.96
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Parallel Computing and Optimization Techniques
Physical Sciences →  Computer Science →  Hardware and Architecture
Low-power high-performance VLSI design
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
VLSI and FPGA Design Techniques
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
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