Dynamic scheduling rule selection for semiconductor wafer fabrication

Abstract

We exploit the speed of an ordinal optimization (OO)-based simulation tool designed by Hsieh et al. (1999) to investigate dynamic selection of scheduling rules for semiconductor wafer fabrication (FAB). Although a scheduling rule is a combination of loading wafer release and dispatching rules, this paper specifically focuses on dispatching when significant amount of wafers-in-process are held due to engineering causes and when major machine failures occur. Four prominent dispatching rules combined with the wafer release policy of workload regulation constitute a basic set of rule options. The dispatching rule may be weekly selected based on FAB states over a four-week horizon. A total of 756 rule options are then evaluated and ranked by the OO-based simulation tool under the performance index of mean cycle time and throughput rate. Results demonstrate the value of dynamic rule selection for uncertainty handling, the insightful selection of good rules and the needs for further research.