Fabrication of micro-trench structures with high aspect ratio based on DRIE process for MEMS device applications

Maoxiang Guo; Xiujian Chou; Jiliang Mu; Liu Bing; Jijun Xiong

doi:10.1007/s00542-012-1720-9

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Fabrication of micro-trench structures with high aspect ratio based on DRIE process for MEMS device applications

Maoxiang Guo Xiujian Chou Jiliang Mu Liu Bing Jijun Xiong

Year: 2013 Journal: Microsystem Technologies Vol: 19 (7)Pages: 1097-1103 Publisher: Springer Science+Business Media

DOI: 10.1007/s00542-012-1720-9

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Keywords:

Deep reactive-ion etching Trench Microelectromechanical systems Materials science Etching (microfabrication) Fabrication Optoelectronics Substrate (aquarium) Scanning electron microscope Surface finish Silicon Surface roughness Aspect ratio (aeronautics) Reactive-ion etching Shallow trench isolation Nanotechnology Composite material Geology Layer (electronics)

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Plasma Diagnostics and Applications

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced MEMS and NEMS Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Nanowire Synthesis and Applications

Physical Sciences → Engineering → Biomedical Engineering

Fabrication of micro-trench structures with high aspect ratio based on DRIE process for MEMS device applications

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