Electrospray deposition of thin copper-indium-diselenide films

Abstract

Abstract Electrospray deposition is fast finding application in the field of thin film device manufacturing processes. The ease and cost efficiency attached to electrospray deposition with possible integration with roll-to-roll fabrication lines is the potential future of thin film device manufacturing. In this study thin films composed of copper-indium-diselenide, more commonly known as CIS, have been made using the electrospray deposition of nano-particle based inks for the ultimate manufacture of CIS-based solar cells. It is the first time that a complete CIS layer has been deposited through electrospray in a single step without involving any other process. Deposited layers are thoroughly characterized using techniques such as scanning electron microscope, X-ray diffraction and X-ray photoelectron spectroscopy. Moderate voltage requirements, dense, large grained, ∼1 μm thick layers and reasonable sintering temperatures involved in the electrospray deposition process promise the possible applicability of electrospray deposition in the manufacturing of cheap and easy to build solar cells.