Electrical characterization of carbon nanotube vertical interconnects with different lengths and widths

Abstract

Carbon nanotubes (CNT) can be an attractive candidate for vertical interconnects due to their bottom-up nature and excellent electrical and thermal properties. In this paper we demonstrate low temperature high-density CNT growth and results of electrical characterization. We determined that our CNT contact resistance is low compared to other results in literature, likely caused by a good top contact. The CNT display good uniformity over the wafer and the calculated resistivity of 10 mΩ-cm is among the lowest in literature.