Photoreductive Deposition of Palladium for Electroless Copper Plating

Koji Kondo; Futoshi Ishikawa; Nobumasa Ishida; Masahiro Irie

doi:10.1246/cl.1992.999

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JOURNAL ARTICLE

Photoreductive Deposition of Palladium for Electroless Copper Plating

Koji Kondo Futoshi Ishikawa Nobumasa Ishida Masahiro Irie

Year: 1992 Journal: Chemistry Letters Vol: 21 (6)Pages: 999-1002 Publisher: Oxford University Press

DOI: 10.1246/cl.1992.999

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Abstract

Abstract Selective seeding of palladium catalysts on an alumina plate for electroless copper plating was made by photoirradiation. The adsorbed Pd(II)-tartrate were selectively converted to Pd(0) by photoirradiation and the photogenerated Pd(0) catalyzed the electroless copper plating.

Keywords:

Chemistry Palladium Copper Copper plating Deposition (geology) Plating (geology) Metallurgy Inorganic chemistry Electroplating Catalysis Organic chemistry

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Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Electrodeposition and Electroless Coatings

Physical Sciences → Engineering → Electrical and Electronic Engineering

Photoreductive Deposition of Palladium for Electroless Copper Plating

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