JOURNAL ARTICLE
Effect of Nano-Size Silica Abrasives in Chemical Mechanical Polishing of Copper
Year: 2004 Journal: MRS Proceedings Vol: 816 Publisher: Cambridge University Press
Keywords:
Polishing Materials science Chemical-mechanical planarization Copper Surface roughness Layer (electronics) Metallurgy Nano- Oxide Copper oxide Surface finish Composite material
Metrics
5
Cited By
0.29
FWCI (Field Weighted Citation Impact)
4
Refs
0.61
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Advanced Surface Polishing Techniques
Physical Sciences → Engineering → Biomedical Engineering
Advanced machining processes and optimization
Physical Sciences → Engineering → Mechanical Engineering
Diamond and Carbon-based Materials Research
Physical Sciences → Materials Science → Materials Chemistry
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