JOURNAL ARTICLE

Effect of Nano-Size Silica Abrasives in Chemical Mechanical Polishing of Copper

Suho JungRajiv K. Singh

Year: 2004 Journal:   MRS Proceedings Vol: 816   Publisher: Cambridge University Press
Keywords:
Polishing Materials science Chemical-mechanical planarization Copper Surface roughness Layer (electronics) Metallurgy Nano- Oxide Copper oxide Surface finish Composite material

Metrics

5
Cited By
0.29
FWCI (Field Weighted Citation Impact)
4
Refs
0.61
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Advanced Surface Polishing Techniques
Physical Sciences →  Engineering →  Biomedical Engineering
Advanced machining processes and optimization
Physical Sciences →  Engineering →  Mechanical Engineering
Diamond and Carbon-based Materials Research
Physical Sciences →  Materials Science →  Materials Chemistry

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