Chemical–mechanical polishing of copper and tantalum with silica abrasives

Y. Li; M. Hariharaputhiran; S. V. Babu

doi:10.1557/jmr.2001.0148

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Chemical–mechanical polishing of copper and tantalum with silica abrasives

Y. Li M. Hariharaputhiran S. V. Babu

Year: 2001 Journal: Journal of materials research/Pratt's guide to venture capital sources Vol: 16 (4)Pages: 1066-1073 Publisher: Springer Nature

DOI: 10.1557/jmr.2001.0148

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Keywords:

Materials science Tantalum Fumed silica Copper Chemical-mechanical planarization Polishing Slurry Abrasive Metallurgy Adsorption Amorphous silica Particle (ecology) Composite material Chemical engineering

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Advanced Surface Polishing Techniques

Physical Sciences → Engineering → Biomedical Engineering

Diamond and Carbon-based Materials Research

Physical Sciences → Materials Science → Materials Chemistry

Advanced machining processes and optimization

Physical Sciences → Engineering → Mechanical Engineering

Chemical–mechanical polishing of copper and tantalum with silica abrasives

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