JOURNAL ARTICLE

Chemical–mechanical polishing of copper and tantalum with silica abrasives

Y. LiM. HariharaputhiranS. V. Babu

Year: 2001 Journal:   Journal of materials research/Pratt's guide to venture capital sources Vol: 16 (4)Pages: 1066-1073   Publisher: Springer Nature
Keywords:
Materials science Tantalum Fumed silica Copper Chemical-mechanical planarization Polishing Slurry Abrasive Metallurgy Adsorption Amorphous silica Particle (ecology) Composite material Chemical engineering

Metrics

64
Cited By
6.36
FWCI (Field Weighted Citation Impact)
18
Refs
0.97
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Advanced Surface Polishing Techniques
Physical Sciences →  Engineering →  Biomedical Engineering
Diamond and Carbon-based Materials Research
Physical Sciences →  Materials Science →  Materials Chemistry
Advanced machining processes and optimization
Physical Sciences →  Engineering →  Mechanical Engineering

Related Documents

JOURNAL ARTICLE

Chemical Mechanical Polishing for Oxygen Free Copper with Manganese Oxide Abrasives

Ryunosuke SATOYoshio ICHIDAYoshitaka MorimotoKenji Shimizu

Journal:   Journal of Advanced Mechanical Design Systems and Manufacturing Year: 2008 Vol: 2 (4)Pages: 685-693
JOURNAL ARTICLE

Chemical Mechanical Polishing for Oxygen Free Copper with Manganese Oxide Abrasives

Ryunosuke SATOYoshio ICHIDAYoshitaka MorimotoKenji Shimizu

Journal:   Proceedings of International Conference on Leading Edge Manufacturing in 21st century LEM21 Year: 2007 Vol: 2007.4 (0)Pages: 7B203-7B203
JOURNAL ARTICLE

Chemical-Mechanical Polishing of Wafers with Copper Film by Nano-Scale Abrasives

Jhy-Cherng TsaiJin Fong Kao

Journal:   Materials science forum Year: 2008 Vol: 594 Pages: 181-186
JOURNAL ARTICLE

Electrochemical Mechanical Polishing of Copper with High Permittivity Abrasives

Weisi LiDongming GuoZhuji JinZhe WangZewei Yuan

Journal:   Materials and Manufacturing Processes Year: 2013 Vol: 28 (2)Pages: 207-212
© 2026 ScienceGate Book Chapters — All rights reserved.