Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue

Liang Yin; Luke Wentlent; Linlin Yang; Babak Arfaei; Awni Oasaimeh; Peter Børgesen

doi:10.1007/s11664-011-1762-2

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Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue

Liang Yin Luke Wentlent Linlin Yang Babak Arfaei Awni Oasaimeh Peter Børgesen

Year: 2011 Journal: Journal of Electronic Materials Vol: 41 (2)Pages: 241-252 Publisher: Springer Science+Business Media

DOI: 10.1007/s11664-011-1762-2

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Keywords:

Recrystallization (geology) Materials science Soldering Metallurgy Intergranular corrosion Grain boundary Dynamic recrystallization Ball grid array Hot working Microstructure Composite material Geology

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Metallurgy and Material Forming

Physical Sciences → Engineering → Mechanics of Materials

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Metal Forming Simulation Techniques

Physical Sciences → Engineering → Mechanical Engineering

Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue

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Citation History

Topics

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