JOURNAL ARTICLE

Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints

Peter HackeA.F. SprecherH. Conrad

Year: 1997 Journal:   Journal of Electronic Materials Vol: 26 (7)Pages: 774-782   Publisher: Springer Science+Business Media
Keywords:
Microstructure Soldering Materials science Metallurgy Solid-state physics Composite material Condensed matter physics Physics

Metrics

47
Cited By
1.82
FWCI (Field Weighted Citation Impact)
22
Refs
0.85
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Advanced Welding Techniques Analysis
Physical Sciences →  Engineering →  Mechanical Engineering
Fatigue and fracture mechanics
Physical Sciences →  Engineering →  Mechanics of Materials
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