JOURNAL ARTICLE
Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints
Peter HackeA.F. SprecherH. Conrad
Year: 1997 Journal: Journal of Electronic Materials Vol: 26 (7)Pages: 774-782 Publisher: Springer Science+Business Media
Keywords:
Microstructure Soldering Materials science Metallurgy Solid-state physics Composite material Condensed matter physics Physics
Metrics
47
Cited By
1.82
FWCI (Field Weighted Citation Impact)
22
Refs
0.85
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Advanced Welding Techniques Analysis
Physical Sciences → Engineering → Mechanical Engineering
Fatigue and fracture mechanics
Physical Sciences → Engineering → Mechanics of Materials
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BOOK-CHAPTER
The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder Joints
J. W. MorrisD. TribulaT. S. E. SummersD. Grivas
Year: 1991 Pages: 225-265