S.D.S. MalhiP.K. ChatterjeeRussell F. PinizzottoHon Wai LamC.E.C. ChenH. ShichijoRajiv R. ShahD.W. Bellavance
p-channel MOSFET's have been fabricated in LPCVD polysilicon. A 5000-Å n + poly acts as the gate electrode on which a 500-Å thermal oxide is grown to act as the gate insulator. Then a 1500-Å LPCVD polysilicon layer is deposited at 620°C and is subsequently boron doped to form the conductive channel. Devices with channel length as small as 2 µm show well-behaved transistor characteristics. The drive current and leakage current are as suitable for usage as load element in memory applications. At large gate voltages the accumulation hole mobility is 9 cm 2 /V.s. The drain-to-source breakdown voltage exceeds -20 V.
H. ShichijoS.D.S. MalhiP.K. ChatterjeeA.H. ShahG. PollackW. H. RichardsonRajiv R. ShahMatthew DouglasHon Wai Lam
J.G. FossumA. Ortíz-CondeH. ShichijoS. Banerjee
H. ShichijoS.D.S. MalhiP.K. ChatterjeeRajiv R. ShahMatthew DouglasHon Wai Lam
S. Verdonckt-VandebroekE.F. CrabbéB.S. MeyersonD.L. HarameP.J. RestleJ.M.C. StorkJ. B. Johnson