JOURNAL ARTICLE

p-Channel MOSFET's in LPCVD PolySilicon

S.D.S. MalhiP.K. ChatterjeeRussell F. PinizzottoHon Wai LamC.E.C. ChenH. ShichijoRajiv R. ShahD.W. Bellavance

Year: 1983 Journal:   IEEE Electron Device Letters Vol: 4 (10)Pages: 369-371   Publisher: Institute of Electrical and Electronics Engineers

Abstract

p-channel MOSFET's have been fabricated in LPCVD polysilicon. A 5000-Å n + poly acts as the gate electrode on which a 500-Å thermal oxide is grown to act as the gate insulator. Then a 1500-Å LPCVD polysilicon layer is deposited at 620°C and is subsequently boron doped to form the conductive channel. Devices with channel length as small as 2 µm show well-behaved transistor characteristics. The drive current and leakage current are as suitable for usage as load element in memory applications. At large gate voltages the accumulation hole mobility is 9 cm 2 /V.s. The drain-to-source breakdown voltage exceeds -20 V.

Keywords:
MOSFET Polysilicon depletion effect Electrical engineering Materials science Optoelectronics Chemical vapor deposition Transistor Gate oxide Channel (broadcasting) Electrode Threshold voltage Boron Voltage Analytical Chemistry (journal) Chemistry Engineering

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Citation History

Topics

Thin-Film Transistor Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Semiconductor materials and devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Advancements in Semiconductor Devices and Circuit Design
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
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