JOURNAL ARTICLE
Stresses and interfacial structure in Au–Ni and Ag–Cu metallic multilayers
S. LabatFrançois C. BocquetB. GillesΟ. Thomas
Year: 2003 Journal: Scripta Materialia Vol: 50 (6)Pages: 717-721 Publisher: Elsevier BV
Keywords:
Materials science Metallurgy Metal Crystallography
Metrics
16
Cited By
0.40
FWCI (Field Weighted Citation Impact)
39
Refs
0.57
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Copper Interconnects and Reliability
Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials
Semiconductor materials and interfaces
Physical Sciences → Physics and Astronomy → Atomic and Molecular Physics, and Optics
Metal and Thin Film Mechanics
Physical Sciences → Engineering → Mechanics of Materials
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