JOURNAL ARTICLE

Stresses and interfacial structure in Au–Ni and Ag–Cu metallic multilayers

S. LabatFrançois C. BocquetB. GillesΟ. Thomas

Year: 2003 Journal:   Scripta Materialia Vol: 50 (6)Pages: 717-721   Publisher: Elsevier BV
Keywords:
Materials science Metallurgy Metal Crystallography

Metrics

16
Cited By
0.40
FWCI (Field Weighted Citation Impact)
39
Refs
0.57
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Copper Interconnects and Reliability
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials
Semiconductor materials and interfaces
Physical Sciences →  Physics and Astronomy →  Atomic and Molecular Physics, and Optics
Metal and Thin Film Mechanics
Physical Sciences →  Engineering →  Mechanics of Materials

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