JOURNAL ARTICLE

Trapezoidal Microchannel Heat Sink With Pressure-Driven and Electro-Osmotic Flows for Microelectronic Cooling

Yong HanYong Jiun LeeXiaowu Zhang

Year: 2013 Journal:   IEEE Transactions on Components Packaging and Manufacturing Technology Vol: 3 (11)Pages: 1851-1858   Publisher: Institute of Electrical and Electronics Engineers

Abstract

Thermal performances of the trapezoidal microchannel heat sink (MCHS) with pure pressure driven flow (PDF), pure electro-osmotic flow (EOF) and combined flow have been investigated and compared, using the multiphysics software COMSOL. The feasibility and accuracy of the simulation scheme for the microchannel are carefully validated with available experimental and numerical results for both PDF and EOF. The effects of the electric potential and driving pressure on the performance of the MCHS have been studied under different conditions. The flow rate, thermal resistance, and Nusselt number are investigated to determine the characteristic behavior of the trapezoidal MCHS of various sidewall angles, height-width ratios, and hydraulic diameters.

Keywords:
Microchannel Multiphysics Mechanics Materials science Heat sink Volumetric flow rate Nusselt number Thermal Pressure drop Thermal resistance Microelectronics Thermodynamics Heat transfer Finite element method Physics Optoelectronics

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Citation History

Topics

Heat Transfer and Optimization
Physical Sciences →  Engineering →  Mechanical Engineering
Heat Transfer and Boiling Studies
Physical Sciences →  Engineering →  Mechanical Engineering
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Physical Sciences →  Engineering →  Biomedical Engineering
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