Self-driven manifold microchannel heat sink for cooling electronics

Yitao Shen; Yu-Hui Pan; Jianmin Hao; Rui Zhou; Yin-Fa Yang; Hua Chen; Wen-Long Cheng

doi:10.1016/j.applthermaleng.2024.123373

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Self-driven manifold microchannel heat sink for cooling electronics

Yitao Shen Yu-Hui Pan Jianmin Hao Rui Zhou Yin-Fa Yang Hua Chen Wen-Long Cheng

Year: 2024 Journal: Applied Thermal Engineering Vol: 249 Pages: 123373-123373 Publisher: Elsevier BV

DOI: 10.1016/j.applthermaleng.2024.123373

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Keywords:

Heat sink Heat flux Materials science Microchannel Thermal resistance Mechanics Heat pipe Electronics cooling Micro heat exchanger Mechanical engineering Heat transfer Heat transfer coefficient Engineering Nanotechnology Physics

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Topics

Heat Transfer and Optimization

Physical Sciences → Engineering → Mechanical Engineering

Refrigeration and Air Conditioning Technologies

Physical Sciences → Engineering → Mechanical Engineering

Heat Transfer and Boiling Studies

Physical Sciences → Engineering → Mechanical Engineering

Self-driven manifold microchannel heat sink for cooling electronics

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