Recent advances in isotropic conductive adhesives for electronics packaging applications

Irfan Ahmad Mir; Devendra Kumar

doi:10.1016/j.ijadhadh.2007.10.004

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Recent advances in isotropic conductive adhesives for electronics packaging applications

Irfan Ahmad Mir Devendra Kumar

Year: 2007 Journal: International Journal of Adhesion and Adhesives Vol: 28 (7)Pages: 362-371 Publisher: Elsevier BV

DOI: 10.1016/j.ijadhadh.2007.10.004

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Keywords:

Electronics Electrical conductor Materials science Adhesive Soldering Electronic packaging Isotropy Reliability (semiconductor) Mechanical engineering Nanotechnology Composite material Layer (electronics) Engineering Electrical engineering

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Topics

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Nanofabrication and Lithography Techniques

Physical Sciences → Engineering → Biomedical Engineering

Recent advances in isotropic conductive adhesives for electronics packaging applications

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Citation History

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