JOURNAL ARTICLE
Conductive Adhesives for Electronics Packaging
Year: 2000 Journal: Microelectronics International Vol: 17 (2)Pages: 34-35 Publisher: Emerald Publishing Limited
Keywords:
Adhesive Electrical conductor Electronic packaging Electronics Electrically conductive Materials science Engineering Nanotechnology Electrical engineering Composite material
Metrics
158
Cited By
14.97
FWCI (Field Weighted Citation Impact)
0
Refs
0.99
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Material Properties and Processing
Physical Sciences → Engineering → Mechanics of Materials
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