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JOURNAL ARTICLE
Conductive adhesives for electronics packaging [Book Review]
K.F. Schoch
Year:
2003
Journal:
IEEE Electrical Insulation Magazine
Vol:
19 (2)
Pages:
46-46
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/mei.2003.1192038
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Keywords:
Adhesive
Electrical conductor
Electronics
Materials science
Electronic packaging
Electrically conductive
Electrical engineering
Engineering
Engineering physics
Nanotechnology
Composite material
Metrics
1
Cited By
0.00
FWCI (Field Weighted Citation Impact)
0
Refs
0.11
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Material Properties and Processing
Physical Sciences → Engineering → Mechanics of Materials
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