JOURNAL ARTICLE
Stable thin film encapsulation of acceleration sensors using polycrystalline silicon as sacrificial and encapsulation layer
Arnim HöchstR. ScheuererH. StahlFrank FischerL. MetzgerRalf ReichenbachFranz LärmerS. KronmüllerS. WatchamCristina RusuAnn WitvrouwR. Gunn
Year: 2004 Journal: Sensors and Actuators A Physical Vol: 114 (2-3)Pages: 355-361 Publisher: Elsevier BV
Keywords:
Materials science Microelectromechanical systems Wafer dicing Wafer Silicon Fabrication Optoelectronics Polycrystalline silicon Encapsulation (networking) Nanotechnology Composite material Layer (electronics) Computer science
Metrics
29
Cited By
1.77
FWCI (Field Weighted Citation Impact)
10
Refs
0.86
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Advanced MEMS and NEMS Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Acoustic Wave Resonator Technologies
Physical Sciences → Engineering → Biomedical Engineering
Mechanical and Optical Resonators
Physical Sciences → Physics and Astronomy → Atomic and Molecular Physics, and Optics
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