Interfacial reactions of fine-pitch Cu/Sn–3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies

JOURNAL ARTICLE

Year: 2014 Journal: Journal of Alloys and Compounds Vol: 616 Pages: 394-400 Publisher: Elsevier BV

DOI: 10.1016/j.jallcom.2014.07.124

Keywords:

Intermetallic Kirkendall effect Materials science Copper Metallurgy Void (composites) Bimetal Flip chip Layer (electronics) Composite material Alloy

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