Interfacial reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) systems

Sinn-wen Chen; Shyr-harn Wu; Shou-Wei Lee

doi:10.1007/s11664-003-0010-9

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JOURNAL ARTICLE

Interfacial reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) systems

Sinn-wen Chen Shyr-harn Wu Shou-Wei Lee

Year: 2003 Journal: Journal of Electronic Materials Vol: 32 (11)Pages: 1188-1194 Publisher: Springer Science+Business Media

DOI: 10.1007/s11664-003-0010-9

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Keywords:

Materials science Copper Phase (matter) Phase diagram Intermetallic Metallurgy Solid solution Homogeneity (statistics) Nickel Crystallography Analytical Chemistry (journal) Alloy Chemistry

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Topics

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Welding Techniques Analysis

Physical Sciences → Engineering → Mechanical Engineering

Intermetallics and Advanced Alloy Properties

Physical Sciences → Engineering → Mechanical Engineering

Interfacial reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) systems

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Citation History

Topics

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