JOURNAL ARTICLE

Comparison of Tetrakis(dimethylamido)titanium and Tetrakis(diethylamido)titanium as Precursors for Metallorganic Chemical Vapor Deposition of Titanium Nitride

Ju‐Young YunMan‐Young ParkShi‐Woo Rhee

Year: 1999 Journal:   Journal of The Electrochemical Society Vol: 146 (5)Pages: 1804-1808   Publisher: Institute of Physics

Abstract

Tetrakis(dimethylamido)titanium (TDMAT) and tetrakis(diethylamido)titanium (TDEAT) as precursors for metallorganic chemical vapor deposition of TiN were compared. H-1 nuclear magnetic resonance (NMR) and differential scanning calorimetry (DSC) were used to study the thermal decomposition behavior of the liquid-phase compounds. NMR spectra showed that TDEAT was thermally stable up to 220 degrees C, while TDMAT began to decompose over 140 degrees C. DSC results also confirmed that TDEAT had a better thermal stability than TDMAT. The gas-phase reaction mechanism of the compounds monitored by in situ Fourier transform infrared spectroscopy and TDEAT was decomposed at higher temperature due to its steric hindrance effect. TDMAT and TDEAT had a similar dissociation mechanism in the liquid and gas phase. Both precursors were decomposed at high temperatures into Ti metal and dialkylamine. The deposition rate of TiN was higher with TDMAT than with TDEAT, and TiN films deposited with TDMAT showed lower carbon content and smooth surface morphology. (C) 1999 The Electrochemical Society. S0013-4651(98)07-050-5. All rights reserved.

Keywords:
Tin Titanium Chemical vapor deposition Chemistry Differential scanning calorimetry Thermal decomposition Fourier transform infrared spectroscopy Thermal stability Inorganic chemistry Titanium nitride Analytical Chemistry (journal) Nitride Organic chemistry Chemical engineering

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2
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0.93
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Citation History

Topics

Metal and Thin Film Mechanics
Physical Sciences →  Engineering →  Mechanics of Materials
Copper Interconnects and Reliability
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials
Semiconductor materials and devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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