JOURNAL ARTICLE

Novel positive-tone thick photoresist for high aspect ratio microsystem technology

Gen-Wen HsiehYu‐Hung HsiehChii-Rong YangY.-D. Lee

Year: 2002 Journal:   Microsystem Technologies Vol: 8 (4-5)Pages: 326-329   Publisher: Springer Science+Business Media
Keywords:
Photoresist LIGA Materials science Aspect ratio (aeronautics) Microsystem Microstructure Polymethyl methacrylate Resist Optoelectronics Composite material Fabrication Nanotechnology Polymer Layer (electronics)

Metrics

5
Cited By
0.63
FWCI (Field Weighted Citation Impact)
0
Refs
0.68
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Advancements in Photolithography Techniques
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Thin-Film Transistor Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Nanofabrication and Lithography Techniques
Physical Sciences →  Engineering →  Biomedical Engineering

Related Documents

JOURNAL ARTICLE

Novel two-step baking process for high-aspect-ratio photolithography with conventional positive thick photoresist

Jun‐Bo YoonChul‐Hi HanEuisik YoonChoong-Ki Kim

Journal:   Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Year: 1998 Vol: 3512 Pages: 316-316
JOURNAL ARTICLE

High-Aspect-Ratio Nanoscale Patterning in a Negative Tone Photoresist

Kwangki RyooJeong‐Bong Lee

Journal:   Journal of information and communication convergence engineering Year: 2015 Vol: 13 (1)Pages: 56-61
JOURNAL ARTICLE

A thick photoresist process for high aspect ratio MEMS applications

Elias LaforgeRicky AnthonyPaul McCloskeyCian O’Mathúna

Journal:   Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Year: 2016 Vol: 10032 Pages: 1003203-1003203
© 2026 ScienceGate Book Chapters — All rights reserved.